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1902025 年 10 月 22 日消息,因中国对安世半导体(Nexperia,实际由中国闻泰科技控股) 生产的半导体实施出口限制(背景为荷兰政府此前依据 “保护战略产业” 紧...
查看全文According to a report by Nikkei, Renesas Electronics Corp of Tokyo, Japan is abandoning its plans to produce silicon carbide (SiC) power semiconductors for electric vehicles (EVs), due to slowing growth in the EV market — coupled with a supply glut driven by increased production from Chinese manufacturers — that has led to falling prices.据日经新闻报道,由于电动汽车市场增长放缓,加上中国制造商增产导致供应过剩,从而致使价格下跌,日本东京的瑞萨电子株式会社正放弃其为电动汽车生产碳化硅(SiC)功率半导体的计划。
In July 2023, Renesas announced its plans to enter the SiC power device market and begin manufacturing SiC power chips in early 2025 at its Takasaki plant in Gunma Prefecture. However, the firm has since disbanded the SiC team there.2023年7月,瑞萨电子宣布计划进军碳化硅功率器件市场,并于2025年初在群马县高崎工厂开始生产碳化硅功率芯片。然而,该公司后来解散了那里的碳化硅团队。
Nikkei adds that price competition with Chinese rivals is expected to intensify over the medium to long term, making it difficult for Renesas — as a latecomer — to generate quick profits from SiC chip production.《日经亚洲评论》还补充称,从中长期来看,与中国竞争对手的价格竞争预计将会加剧,这使得瑞萨电子作为后来者,很难从碳化硅芯片生产中快速获利。
According to the latest research by market analyst firm TrendForce, weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024. Simultaneously, intensifying competition and sharp price declines have driven global revenue for N-type SiC substrates down by 9% year-on-year to US$1.04bn. Notably, Chinese vendors TanKeBlue and SICC have rapidly risen to prominence, capturing 17.3% and 17.1% of global market share, respectively.根据市场分析公司集邦咨询(TrendForce)的最新研究,汽车和工业领域需求的减弱,减缓了2024年碳化硅衬底的出货量增长。与此同时,竞争加剧和价格大幅下跌,使得全球N型碳化硅衬底营收同比下降9%,降至10.4亿美元。值得注意的是,中国供应商天科合达和山东天岳迅速崛起,分别占据了全球17.3%和17.1%的市场份额。
On the other hand, as highlighted by Nikkan Kogyo Shimbun, Renesas could face repercussions due to its 10-year deal, signed in July 2023 (involving a US$2bn upfront deposit), for Wolfspeed Inc of Durham, NC, USA to supply it with 150mm- and 200mm-diameter SiC substrates and epiwafers. Wolfspeed is said to be preparing to file for Chapter 11 bankruptcy. In this eventuality, Renesas may be forced to recognize impairment losses, the report suggests.另一方面,正如《日经产业新闻》所强调的,瑞萨电子可能会因其2023年7月签署的一份为期10年的协议(涉及20亿美元的预付款)而面临影响,该协议是与美国北卡罗来纳州达勒姆市的Wolfspeed公司签订的,由后者向其供应直径150毫米和200毫米的碳化硅衬底及外延片。据说Wolfspeed公司正准备申请破产保护。报道指出,在这种情况下,瑞萨电子可能不得不确认减值损失。
While the pressure from Wolfspeed’s financial troubles and intensifying competition from Chinese rivals has caused Renesas to halt in-house production of SiC power chips, the firm does not plan to exit the market entirely, notes TrendForce. Instead, it may continue to develop its own SiC designs while outsourcing manufacturing to foundries, then sell the finished products under its own brand.集邦咨询指出,尽管Wolfspeed的财务困境以及来自中国竞争对手日益激烈的竞争,已导致瑞萨电子停止碳化硅功率芯片的内部生产,但该公司并不打算完全退出市场。相反,它可能会继续开发自己的碳化硅设计,同时将制造外包给代工厂,然后以自己的品牌销售成品。
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